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F75383M/F75383S/F75384M/F75384S
O 1oC Accuracy Temperature Sensor IC Datasheet
Release Date: July, 2007 Revision: V0.32P
F75383/F75384
F75383/F75384 Datasheet Revision History
Version
0.21P 0.22P 0.23P 0.24P 0.25P 0.26P 0.27P
Date
Mar.,2004 Mar.,2004 Mar.,2004 Mar.,2004 Apr.,2004 Jul.,2004 Sep.,2004
Page
Original version (Confidential)
Revision History
Revised version ID/vendor ID, AC/DC spec. Add 8-SOP(F75383) package supporting
1-2 8,13
Add additional description of 8-SOP(F75383S)/8-MSOP(F75383M) Add PCB Layout guide and update DC specification Add F75384 description
6 12
Revise(1)High Byte of 1C value (0000 0001) (2) Read address (high byte) of VT2 low limit (08h (00h) ) Revise serial bus timing Modify alert response address Revise typo and updated patent no.
0.28P 0.29P 0.30P 0.31P
Jan.,2005 Aug.,2005 Dec.,2005 Dec.,2006
15 4
1 -
Add Patent Note Revise typo ( VDD Company readdress VCC)
0.32P
July,2007
-
Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Fintek for any damages resulting from such improper use or sales.
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F75383/F75384 Table of Contents
1. 2. 3. 4. 5. 6. General Description................................................................................................................. 1 Features .................................................................................................................................. 1 Key Specifications ................................................................................................................... 2 Pin Configuration..................................................................................................................... 2 Pin Descriptions ...................................................................................................................... 2 Functional Description............................................................................................................. 3 6.1 General Description.......................................................................................................... 3 6.2 The warning message ...................................................................................................... 3 6.3 Access Interface............................................................................................................... 3 6.4 Typical Operating Characteristics ...................................................................................... 5 6.5 Temperature Monitoring ..................................................................................................... 6 6.5 Alert#................................................................................................................................ 6 6.6 THERM# ............................................................................................................................ 7 6.7 ADC Conversion Sequence ............................................................................................... 7 6.8 Thermal Mass and Self Heating......................................................................................... 7 6.9 ADC Noise Filtering ........................................................................................................... 7 6.10 PCB Layout Guide........................................................................................................... 8 7. Registers Description .............................................................................................................. 9 7.1 Configuration Register Index 03h(Read), 09h(Write)................................................... 9 7.2 Status Register Index 02h .............................................................................................. 9 7.3 Conversion Rate Register Index 04h(Read), 0Ah(Write).............................................. 10 7.4 One-Shot Register Index 0Fh...................................................................................... 10 7.5 Alert Queue & Timeout Register Index 22h .................................................................. 10 7.6 Status-with-ARA Control Register Index 24h ............................................................. 11 7.7 Chip ID I Register Index 5Ah........................................................................................ 11 7.8 Chip ID II Register Index 5Bh....................................................................................... 11 7.9 Vendor ID I (Manufacturer ID) Register Index 5Dh....................................................... 11 7.10 Vendor ID I (Manufacturer ID) Register Index 5Eh ..................................................... 11 7.11 Vendor ID II (Manufacturer ID) Register Index FEh .................................................... 11 7.12 Value RAM Index 10h- 2Fh ........................................................................................ 11 8. Electrical characteristic.......................................................................................................... 12 8.1 Absolute Maximum Ratings .............................................................................................. 12 8.2 DC Characteristics ............................................................................................................ 12 8.3 AC Characteristics ............................................................................................................ 14 9. Package Dimensions............................................................................................................. 15
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10 Application Circuit .................................................................................................................. 17
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1.
General Description
The F75383/F75384 is a temperature sensor IC with alert signal which is specific designed for notebook, graphic cards etc. An 11-bit analog-to-digital converter (ADC) was built inside F75383/F75384. The F75383/F75384 can monitor two set of temperature which is very important for the system to work stably and properly. This chip provides 1 remote temperature sensor and 1 local temperature sensor. The remote temperature sensor can be performed by CPU thermal diode or transistor 2N3906. The users can set up the upper and lower limits (alarm thresholds) of all monitored parameters and this chip can also issue warning messages for system protection when there is something wrong with monitored items.
Through the BIOS or application software, the users can read all the monitored parameters of system all the time. And a pop-up warning can be also activated when the monitored item was out of the proper/pre-setting range. The application software could be Fintek's application utility, or other management application software. The F75383/F75384 is in the package of 8-pin MSOP/SOP and powered by 3.3V.
2.
Features
Provide 1 on-chip local and 1 remote temperature sensing O 1 oC accuarcy on remote channel and O 3 oC accuarcy on local channel O 1 oC (+60 oC to +100 oC, remote) O 3 oC (+60 oC to +100 oC, local) ALERT# output for SMBus alert THERM# output for over temperature alert or for system shut down Programmable THERM# limits and THERM# hysteresis Programmable alert queue Programmable limited and setting points(alert threshold) for all monitored items 2 wire SMBus interface 3VCC operation and in 8-SOP/8-MSOP green class package 8-MSOP Package - F75383M/F75384M ; 8-SOP Package - F75383S/F75384S The difference between F75383 and F75384 is SMBus address ID and they have the following SMBus slave address:
A6 F75383 F75384 1 1 A5 0 0 A4 0 0 A3 1 1 A2 1 1 A1 0 0 A0 0 1
Noted: Patented TW 235231 TWI263778
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3.
Key Specifications
Supply Voltage Supply Current 3.0~3.6V 180 uA (typ)
4.
Pin Configuration
VCC D+ DTHERM#
1 2 3 4
8
SCL SDA ALERT# GND
F75383 F75384
7 6 5
5.
I/O12t
Pin Descriptions
- TTL level bi-directional pin with 12 mA source-sink capability - TTL level and schmitt trigger - Output pin with 12 mA source-sink capability - Output pin with 24 mA source-sink capability, output 4V - Output pin(Analog) - Open-drain output pin with 12 mA sink capability - TTL level input pin - TTL level input pin and schmitt trigger - Input pin(Analog)
I/O12ts O12 O24V4 AOUT OD12 INt INts AIN
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PIN NO 1 2 3 PIN NAME VCC D+ DTYPE PWR 3VCC 3VCC 3VCC Power Pin Positive connection to remote temperature sensor (ex: thermal diode anode) Negative connection to remote temperature sensor(ex: thermal diode cathode) 4 THERM# DESCRIPTION
PWR AIN AIN
OD12
3VCC
Active LOW output. This pin will be logic low when the temperature exceeds its limit.
5 6 7 8
GND ALERT# SDA SCL
PWR OD12
3VCC 3VCC 3VCC 3VCC
Ground Active LOW output. Used as SMBus alert or Interrupt Serial bus data Serial bus clock
INts/OD12 INt s
6. Functional Description
6.1
General Description
The F75383/F75384 is a simple temperature sensor with warning signal output. It includes a local and a remote temperature sensor. Both measured temperature are compared with its high, low and THERM limits which are stored in the registers. When one or more out-of-limit events occur, the flags in Status Register will be set and that may cause ALERT output to low. Also, measured temperature exceeding THERM limit may cause THERM output to low.
6.2
The warning message
Pin4 and pin6 act as warning message when the temperature exceeds it threshold point.
6.3
Access Interface
The F75383/F75384 can be connected to a compatible 2-wire serial system management bus as a slave device under the control of the master device, using two device terminals SCL and SDA. The F75383/F75384 supports SMBus protocol of, "Write Byte", "Read Byte", both with or without Packet Error checking(PEC) which is calculated using CRC-8. For detail information about PEC, please check SMBus 1.1 specification. F75383/F75384 supports 25ms timeout for no activity on the SMBus. This timeout function is programmed at 22h bit7 and default is disabled. F75383/F75384 also supports Alert Response Address(ARA) protocol.
The operation of the protocol is described with details in the following sections.
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(a) SMBus write to internal address register followed by the data byte
0 SCL SDA
Start By Master
7
8
0
7
8
1
0
0
1
1
0
0
R/W
Ack by 383
D7
D6
D5
D4
D3
D2
D1
D0
Ack by 383
Frame 1 Serial Bus Address Byte 0
Frame 2 Internal Index Register Byte
7 SCL (Continued) SDA (Continued) D7 D6 D5 D4 D3 D2 D1 D0
8
Stop by Master
Frame 3 Data Byte
Figure 1. Serial Bus Write to Internal Address Register followed by the Data Byte
(b) Serial bus write to internal address register only
0 SCL SDA
Start By Master
7
8
0
7
8
1
0
0
1
1
0
0
R/W
Ack by 383
D7
D6
D5
D4
D3
D2
D1
D0
Ack by 383 Stop by Master
Frame 1 Serial Bus Address Byte 0
Frame 2 Internal Index Register Byte
Figure 2. Serial Bus Write to Internal Address Register Only
(c) Serial bus read from a register with the internal address register prefer to desired location
0 SCL SDA
Start By Master
7
8
0
7
8
1
0
0
1
1
0
0
R/W
Ack by 383
D7
D6
D5
D4
D3
D2
D1
D0
Ack by Master Stop by Master
Frame 1 Serial Bus Address Byte 0
Frame 2 Internal Index Register Byte
Figure 3. Serial Bus Read from Internal Address Register
(d) Alert Response Address
0 SCL R/W SDA
Start By Master
7
8
0
7
8
0
0
0
1
1
0
0
Ack by 383
0
1
0
0
1
1
0
0
Ack by Master Stop by Master
Frame 1 Alert Response Address 0
Frame 2 Device Address
Figure 4. Alert Response Address
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6.4 Typical Operating Characteristics
Temperature Error vs.D+/D- Capacitance
Temperature error(J ) vs. D+/D- capacitance
1 0 -2 -3 -4 -5 -6 -7 -8 -9 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
-0.6 0.8 0.6
Local Temperature Error vs. Die Temperature
Local Temperature error(J )
Temperature error(J )
-1
Temperature error(J
0.4 0.2 0 -0.2 -0.4
0
10
20
30
40
50
60
70
80
90
100
Capacitance(nf)
Temperature(J )
Remote Diode Error vs. Remote Temperature Error
0.6 0.4
Te m pe ra ture Erroe
0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0 20 40
Te m pe ra ture
60
80
100
120
Operating Supply Current vs. Conversion Rate
250
Operating current (uA)
Operating current (uA)
200
150
100
50
0
0.0625 0.125 0.25 0.5 1 2 4 8 16 32 64
Conversion rate(Hz)
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6.5 Temperature Monitoring
The F75383/F75384 monitors a local and a remote temperature sensor. Both can be measured from 0C to 140.875C. The temperature format is as the following table:
Temperature ( High Byte )
Digital Output
Temperature ( Low Byte )
Digital Output
0C 1C 25C 50C 75C 90C 100C 140C
0000 0000 0000 0001 0001 1001 0011 0010 0100 1011 0101 1010 0110 0100 1000 1100
0C 0.125C 0.250C 0.375C 0.500C 0.625C 0.750C 0.875C
000 0 0000 001 0 0000 010 0 0000 011 0 0000 100 0 0000 101 0 0000 110 0 0000 111 0 0000
Remote-sensor transistor manufacturers
Manufacturer Panasonic Philips
Model Number 2SB0709 2N3906 PMBT3906
6.5
Alert#
Five events can trigger ALERT# to low: (1). VT1(Local) temperature exceeds High Limit (2). VT1(Local) temperature goes below Low Limit (3). VT2(Remote) temperature exceeds High Limit (4). VT2(Remote) temperature goes below Low Limit (5). VT2(Remote) temperature is Open-circuit.
These five events are wired-NOR together. This means that when one of out-of-limit event occurs, the ALERT# output goes low if the MASK control is disabled. ALERT# signal can be used as an IRQ-like interrupt or as an SMBALERT. When ALERT# acts as an IRQ-like interrupt, the ALERT# will be de-asserted until the following 2 conditions are matched: (1). The abnormal condition is gone
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(2). Reading the Status register to clear the status
When ALERT# acts as a SMBALERT, the ALERT# will be de-asserted until the following 3 conditions are matched: (1). The abnormal condition is gone (2). Reading the Status register to clear the status (3). The ALERT# has been serviced by the SMBus master reading the device address. For more information about SMBALERT, please see SMBus 1.1 specification.
6.6 THERM#
Either VT1(Local) or VT2(Remote) temperature exceeds the corresponding THERM limit, the THERM# output will assert low. The asserted output will be de-asserted until the temperature goes below (THERM Limit - Hysteresis). The hysteresis default value is 10C and it can be programmed. Both VT1 and VT2 have their own THERM limits and Hysteresis values.
6.7 ADC Conversion Sequence
If a START command is written, both channels are converted and the results of both measurements are available after the end of conversion. A BUSY status bit in the status byte shows that the device is actually performing a new conversion; however, even if the ADC is busy, the results of the previous conversion are always available.
6.8 Thermal Mass and Self Heating
Thermal mass effect can seriously degrade the F75383's effective accuracy. The thermal time constant of the SOP package is about 140 in still air. For the F75383/S junction temperature to settle to within +1C after a sudden +100C change requires about five time constants or 12 minutes. The use of smaller packages for remote sensors such as SOT23, improves the situation. Take care to account for thermal gradients between the heat source and the sensor package do not interfere with measurement accuracy. Sel-heating does not significantly affect measurement accuracy. Remote sensor self-heating due to the diode current source is negligible. For the local diode, the worst case error occurs when auto-converting at the fastest rate and simultaneously sinking maximum current at the ALERT# output. For instance, at an 64Hz rate and ALERT# sink around 0.7mA when pull up resistor 4.7K ohm to 3.3VCC, the typical power dissipation is VCC x 220 uA plus 0.4V x 0.7mA. Package c 3.3V and no copper PC board heat-sinking, the resulting temperature rise is: dT = 1.01mW x 120 C/W = 0.12 C
JA
is about 120 C/W, so with VCC =
Even with these contrived circumstances, it is difficult to introduce significant self-heating errors.
6.9 ADC Noise Filtering
The ADC is integrating type with inherently good noise rejection. Micro-power operation places constraints on high-frequency noise rejection; therefore, careful PCB board layout and suitable external filtering are required for high-accuracy remote measurement in
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electronically noisy environment. High frequency EMI is best filtered at D+ and D- with an external 2200pF capacitor. Too high capacitance may introduce errors due to the rise time of the switched current source. Nearly all noise sources tested cause the ADC measurement to be higher than the actual temperature, depending on the frequency and amplitude.
6.10 PCB Layout Guide
PCB can be electrically noisy environments, and the F75383/F75384 is measuring very small voltage from the remote sensor, so care must be taken to minimize noise which is occurred at the sensor inputs. The following guideline should be taken to reduce the measurement error of the temperature sensors:
1.
Place the F75383/F75384 as close as practical to the remote sensing diode. In noisy environments, such as a computer main-board, the distance can be 4 to 8 inches. (typ). This length can be increased if the worst noise sources are avoided. Noise sources generally include clock generators, CRTs, memory buses and PCI/ISA bus etc.
2.
Route the D+ and D- tracks close together, in parallel, with grounded guard tracks on each side. Provide a ground plane under the tracks if possible. Do not route D+ & D- lines next to the deflection coil of the CRT. And also don't route the trace across fast digital signals which can easily induce bigger error.
GND 10MILS DXP MINIMUM DXN 10MILS GND 10MILS 10MILS
3.
Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track minimum width and spacing is recommended.
4.
Try to minimize the number of copper/solder joints, which can cause thermocouple effects. Where copper/solder joints are used, make sure that they are in both the D+ and D- path and at the same temperature. Thermocouple effects should not be a major problem as 1J corresponds to about 200V. It means that a copper-solder thermocouple exhibits 3V/J , and takes about 200V of the voltage error at D+ & D- to cause a 1J error. measurement error. Adding a few thermocouples causes a negligible
5.
Place a 0.1F bypass capacitor close to the VCC pin. In very noisy environments, place an external 2200pF input filter capacitors across D+, D- close to the F75383/F75384.
6.
If the distance to the remote sensor is more than 8 inches, the use of twisted pair cable is recommended. It will work up to
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around 6 to 12 feet.
7.
Because the measurement technique uses switched current sources, excessive cable and/or filter capacitance will affect the measurement accuracy. When using long cables, the filter capacitor may be reduced or removed. Cable resistance can also induce errors. 1 series resistance introduces about 0.5J error.
7.
Registers Description
7.1 Configuration Register Index 03h(Read),
Power on default <7:0> = 00h
Bit Name Attribute
09h(Write)
Description
7 6 5-0
ALERT_MASK RUN_STOP Reserved
R/W R/W
Set to 1, mask ALERT# signal output. Set to 0, monitor. Set to 1, stop to monitor(software power down).
7.2 Status Register Index 02h
Power on default <7:0> = 00h Bit 7 6 Name ADC_BUSY VT1HIGH Attribute RO RO Set to 1, ADC is converting. Set to 1, VT1 temperature exceeds high limit. Set to 0, VT1 temperature does not exceed high limit. 5 VT1LOW RO Set to 1, VT1 temperature goes below low limit. Set to 0, VT1 temperature does not goes below low limit. 4 VT2HIGH RO Set to 1, VT2 temperature exceeds high limit. Set to 0, VT2 temperature does not exceed high limit. 3 VT2LOW RO Set to 1, VT2 temperature goes below low limit. Set to 0, VT2 temperature does not goes below low limit. 2 1 OPEN VT2THERM RO RO Set to 1, VT2 is open-circuit. Set to 1, VT2 temperature exceeds its THERM limit. Description
0
VT1THERM
RO
Set to 1, VT1 temperature exceeds its THERM limit.
VT1(Local) ; VT2(Remote)
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7.3 Conversion Rate Register Index 04h(Read), 0Ah(Write)
Power on default <7:0> = 08h
Bit Name Attribute Description
7-0
CONV_RATE
R/W
Set conversion times per second. Value 00h 01h 02h 03h 04h 05h Conversion/Sec 0.0625 0.125 0.25 0.5 1 2 Value 06h 07h 08h 09h 0Ah 0Bh ~ FFh Conversion/Sec 4 8 16 32 64 Reserved
7.4 One-Shot Register Index 0Fh
Power on default <7:0> = xxh
Bit Name Attribute Description
7-0
ONE-SHOT
WO
When F75383/F75384 is at standby mode, writing any value to this register will initiate a single conversion and comparison cycle. After the single cycle, F75383/F75384 will returns to standby mode.
7.5 Alert Queue & Timeout Register Index 22h
Power on default <7:0> = 01h
Bit Name Attribute Description
7
EN_I2CTMOUT
R/W
Set to 1, enable serial interface timeout function. (Timeout time = 25ms) Set to 0, disable.
6-4 3-1
Reserved ALERT_QUEUE R/W This number determines how many abnormal measurements must occur before ALERT signal is generated. 000 : Once 001 : Twice
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011 : 3 times 111 : 4 times 0 Reserved RO Always read 1.
7.6 Status-with-ARA Control Register Index 24h
Power on default <7:0> = 01h
Bit Name Attribute Description
7-6 0
Reserved EN_ARA_STS R/W Set to 1, ALERT de-asserted condition is related with ARA. Set to 0, ALERT de-asserted condition is not related with ARA(Alert Response Address).
7.7 Chip ID I Register Index 5Ah
Power on default: 03h.
7.8 Chip ID II Register Index 5Bh
Power on default: 03h.
7.9 Vendor ID I (Manufacturer ID) Register Index 5Dh
Power on default: 19h.
7.10 Vendor ID I (Manufacturer ID) Register Index 5Eh
Power on default: 34h.
7.11 Vendor ID II (Manufacturer ID) Register Index FEh
Power on default: 23h. (programmable)
7.12 Value RAM Index 10h- 2Fh
VT1 : Local Temperature
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VT2 : Remote Temperature
The value in quota is its power-on default value. Description Attribute Read Address (High Byte) Read Address (Low Byte) Write Address (High Byte) Write Address (Low Byte)
VT1 reading VT2 reading VT1 High Limit VT1 Low Limit VT2 High Limit VT2 Low Limit VT1 THERM limit VT1 THERM Hysteresis VT2 THERM limit VT2 THERM Hysteresis
RO RO R/W R/W R/W R/W R/W R/W R/W R/W
00h 01h 05h (55h) 06h (00h) 07h (55h) 08h (00h) 20h (55h) 21h (0Ah) 19h (55h) 23h (0Ah)
1Ah 10h 1Bh (00h) 1Ch (00h) 13h (00h) 14h (00h) 0Bh 0Ch 0Dh 0Eh 20h 21h 19h 23h 1Bh 1Ch 13h 14h
8. Electrical characteristic
8.1 Absolute Maximum Ratings
PARAMETER RATING UNIT
Power Supply Voltage Input Voltage Operating Temperature Storage Temperature
-0.5 to 5.5 -0.5 to VCC+0.5 0 to +140 -55 to 150
V V
C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device
8.2 DC Characteristics
(TA = 0 C to 70 C, VCC = 3.3V 10%, VSS = 0V )
Parameter Conditions MIN TYP 1 1 3 MAX Unit
o
Temperature Error, Remote Diode
60 C < TD < 100 C, VCC = 3.0V to 3.6V 0 C

o o
o
o
C
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Temperature Error, Local Diode Supply Voltage range Average operating supply current 16 Conversions / Sec Rate 0.0625 Conversions / Sec Rate Standby supply current Resolution Under-voltage lockout threshold Power on reset threshold Diode source current High Level Low Level VCC input, Disables ADC , Rising Edge 0 C < TA < 100 C, VCC = 3.0V to 3.6V 3.0
o o
1
3
o
C
3.3 180 90 5 0.125 2.55 2.2 95 10
3.6
V uA uA uA
o
C
V 2.4 V uA uA
(TA = 0 C to 70 C, VCC = 3.3V 10%, VSS = 0V)
PARAMETER SYM. MIN. TYP. MAX. UNIT CONDITIONS
I/O12t - TTL level bi-directional pin with source-sink capability of 12 mA
Input Low Voltage Input High Voltage Output Low Current Output High Current Input High Leakage Input Low Leakage
VIL VIH IOL IOH ILIH ILIL 2.0 10 12 -12
0.8
V V mA VOL = 0.4V VOH = 2.4V VIN = VCC VIN = 0V
-10 +1 -1
mA
A A
I/O12ts - TTL level bi-directional pin with source-sink capability of 12 mA and schmitt-trigger level input
Input Low Threshold Voltage Input High Threshold Voltage Output Low Current Output High Current Input High Leakage Input Low Leakage
VtVt+ IOL IOH ILIH ILIL
0.5 1.6 10
0.8 2.0 12 -12
1.1 2.4
V V mA
VCC = 3.3 V VCC = 3.3 V VOL = 0.4 V VOH = 2.4V VIN = VCC VIN = 0V
-10 +1 -1
mA
A A
8.2 DC Characteristics, continued
PARAMETER SYM. MIN. TYP. MAX. UNIT CONDITIONS
OUT12t - TTL level output pin with source-sink capability of 12 mA
Output Low Current Output High Current
IOL IOH
12
16 -14 -12
mA mA
VOL = 0.4V VOH = 2.4V
OD8 - Open-drain output pin with sink capability of 8 mA
Output Low Current
IOL
6
8
mA
VOL = 0.4V
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OD16 - Open-drain output pin with sink capability of 16 mA
Output Low Current
IOL
12
16
mA
VOL = 0.4V
I/OOD16ts - TTL level bi-directional pin, can select to OD or OUT by register, with 16 mA source-sink capability
Input Low Threshold Voltage Input High Threshold Voltage Output Low Current Output High Current Input High Leakage Input Low Leakage
INt - TTL level input pin
VtVt+ IOL IOH ILIH ILIL
0.5 1.6 6
0.8 2.0 8 -16
1.1 2.4
V V mA
VCC = 3.3 V VCC = 3.3 V VOL = 0.4 V VOH = 2.4V VIN = VCC VIN = 0V
-12 +1 -1
mA
A A
Input Low Voltage Input High Voltage Input High Leakage Input Low Leakage
INts -
VIL VIH ILIH ILIL 2.0
0.8
V V
+1 -1
A A
VIN = VCC VIN = 0 V
TTL level Schmitt-triggered input pin
Input Low Threshold Voltage Input High Threshold Voltage Input High Leakage Input Low Leakage
VtVt+ ILIH ILIL
0.5 1.6
0.8 2.0
1.1 2.4 +1 -1
V V
A A
VCC = 3.3V VCC = 3.3V VIN = VCC VIN = 0 V
8.3 AC Characteristics
t
SCL
t
t R
R
SCL
t HD;SDA
t SU;DAT t SU;STO
SDA IN VALID DATA
t HD;DAT
SDA OUT
Serial Bus Timing Diagram
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Serial Bus Timing PARAMETER SYMBOL MIN. MAX. UNIT
SCL clock period Start condition hold time Stop condition setup-up time DATA to SCL setup time DATA to SCL hold time SCL and SDA rise time SCL and SDA fall time
t-SCL tHD;SDA tSU;STO tSU;DAT tHD;DAT tR tF
0.5 0.5 0.5 50 50
10000
uS uS uS nS nS
0.4 0.4
uS uS
9. Package Dimensions
(F75383/F75384 8-MSOP Package )
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8 5
c
E
HE
L
1
D
4
0.25 O
A Y SEATING PLANE b e A1 GAUGE PLANE
Control demensio are in mileters .
SYMBOL A A1 b c E D e HE Y L DIMENSION IN MM MAX. MIN. 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 3.80 4.00 4.80 5.00 1.27 BSC 6.20 5.80 0.10 0.40 1.27 0 10 DIMENSION IN INCH MIN. MAX. 0.053 0.069 0.010 0.004 0.020 0.013 0.010 0.008 0.157 0.150 0.188 0.196 0.050 BSC 0.228 0.016 0 0.244 0.004 0.050 10
(F75383/F75384 8-SOP Package )
Feature Integration Technology Inc.
Headquarters 3F-7, No 36, Tai Yuan St., Chupei City, Hsinchu, Taiwan 302, R.O.C. TEL : 886-3-5600168 FAX : 886-3-5600166 www: http://www.fintek.com.tw Taipei Office Bldg. K4, 7F, No.700, Chung Cheng Rd., Chungho City, Taipei, Taiwan 235, R.O.C. TEL : 866-2-8227-8027 FAX : 866-2-8227-8037
Please note that all datasheet and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this datasheet belong to their respective owner
F75383/F75384
-16-
July, 2007 V0.32P
10 Application Circuit
Example 1:
TEMPERATURE MONITOR (CPU THERMAL DIODE) THERDA
C1 2200pF D+ VCC3V DC2 0.1u
THERDC
R1 4.7K
R2 4.7K
R3 4.7K
R4 4.7K
Example 2:
U1
TEMPERATURE MONITOR (2N3906)
D+ Q1 2N3906 C3 2200pF
D+ D-
1 2 3 4
VCC D+ DTHERM#
SCL SDA ALERT# GND
8 7 6 5
SCLK SDATA
F75383M D-
Title Size A Date:
Feature Integration Technology Inc. Document Number F75383M Application Circuit Tuesday , January 27, 2004 Sheet 1 of 1 Rev 0.1
-17-
July, 2007 V0.32P

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